PCB manufacturing
Process Capability
Quick response to your quality issues
Process Capability
Rigid features include HDI high level count plates, interleaved microvias, blind/buried holes, back-drilled holes, multiple sequential lam, through-hole fill, metal backing/metal core, and oversized panel options.
Includes the use of various PTFE materials, mixed material stacks, plated cavities, edge plating, high temperature lamination, pattern suppression/stitching, buried resistors, and edge start features.
As experts in rigid-flex and flexible manufacturing, we handle rigid-flex, binders, multi-layers, adhesive and adhesive-free, reinforcement, laser ablation, thin flexible laminates, assembly options, etc.
We specialize in semiconductor reference cards, probe cards, DUTs, and aging boards. Our RF capabilities include high aspect ratios, low loss materials, tackable alloys, tight tolerance drilling and sintering.
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